Product Feature :
1. This product is for BGA24 read and test.
2. Applicable IC size : 6×8 mm , there are two types ball array of IC footprint : 6×4 / 5×5-1 , please confirm which type you want , if you don't specify , we default shipping 6×4 , thanks a lot .
2. Apply to Samsung, Hynix, Sandisk, Toshiba and Intel, etc.
3. Accurate positioning on BGA24 test pad.
4. Support testing with or without solder ball.
5. Life cycle is around 25000 times.
6. With 24 pins and pin pitch 1.0 mm.