1. This product is for LBGA80 read and test.
2. Applicable IC size : 10×12 mm
3. Apply to Samsung, Hynix, Sandisk, Toshiba and Intel, etc.
4. Accurate positioning on LBGA80 test pad.
5. Support testing with or without solder ball.
6. Life cycle is around 25000 times.
7. With 80 pins and pin pitch 1.0 mm.