Product Feature :
1. This product is for BGA64 read and test.
2. Applicable IC size : 11×13 mm
3. Apply to Samsung, Hynix, Sandisk, Toshiba and Intel, etc.
4. Accurate positioning on BGA64 test pad.
5. Support testing with or without solder ball.
6. Life cycle is around 25000 times.
7. With 64 pins and pin pitch 1.0 mm.