Product Feature :
1. This product is for BGA63 read and test.
2. Applicable IC size : 10.5*13.4 mm , we also provide another size 9*11 mm , please see more products in our store .
2. Apply to Samsung, Hynix, Sandisk, Toshiba and Intel, etc.
3. Accurate positioning on BGA63 test pad.
4. Support testing with or without solder ball.
5. Life cycle is around 25000 times.
6. With 63 pins and pin pitch 0.8 mm.
7. Need to fix this test socket onto PCB before testing.