Apply to EMCP Size:
1. Apply to Samsung,HTC,Hynix,Sandisk,MTK,etc--eMCP.
2. Compatible with BGA162 and BGA186.
3. Accurate positioning on eMCP flat bottom and solder ball.
4.Long operating life,up to 25,000 times,faster reading.
5.Apply IC thickness: 0.8mm-1.5mm.
6.Could read and write the data of eMCP.
7.IC size :11.5x13mm/ 12x16mm, 12×18MM, 14×18MM, 11×10MM, 12×13.5MM，pitch:0.5mm.
8. Easy to operate,insert the USB into your PC, could read the eMCP.
9. Support flat bottom and solder ball testing.
20cm x 15cm x 15cm (7.87in x 5.91in x 5.91in)