1. Apply to eMMC of Samsung, Sandisk, Toshiba, Hynix, Micron, HTC, MTK and Intel.
2. Apply to BGA 169 and BGA 153 testing.
3. eMMC data could be read and written fastly.
4. With 30 pins and pin pictch 0.5mm.
5. eMMC size of this product is 12x18mm , we also provide size 11.5x13mm , 12x16mm , 14x18mm , please see more products in our store .
6. Apply to eMMC thickness of 0.8mm and 1.5mm.
7. Accurate positioning on flat bottom pad and solder of eMMC.
8. Life cycle is around 25,000 times.
9. Support flat bottom and solder ball testing.